Hannah Liang is a patent agent, who focuses on preparation and prosecution of patent applications in the fields of electrical engineering, laser applications, MEMS sensors, semiconductor process, advanced packaging technologies, nanotechnology, image processing, IC design and simulation, and wireless communication technologies. She received her PhD degree in electrical engineering from Arizona State University. Prior to becoming a patent agent, she worked for Microchip Technology and Le Technology as a hardware engineer. She has technical experience and expertise in semiconductor device engineering, cleanroom fabrication, optical systems, material characterization, and automation test programming.
Hannah has worked in semiconductor industry at Microchip and Le Technology prior to becoming a patent agent.
“Micro-Strain Sensing Using Wrinkled Stiff Thin Films on Soft Substrates as Tunable Optical Grating”, T Ma, H Liang, G Chen, B Poon, H Jiang, H Yu, Optics Express, 21 (10), 11994-12001, 2013.
“Atomic Configurations at InAs Partial Dislocation Cores Associated with Z-Shape Faulted Dipoles”, L Li, Z Gan, MR McCartney, H Liang, H Yu, Y Gao, J Wang, DJ Smith, Scientific Reports 3, 3229, 2013.
“Highly Sensitive In-Plane Strain Measurement Using a Laser Scanning Technique”, H Liang, T Ma, C Lv, H Nguyen, G Chen, H Wu, R Tang, H Jiang, H Yu, IEEE Electronic Components and Technology Conference (ECTC), Orlando, FL, 2014.
“Origami-Enabled Deformable Silicon Solar Cells”, R Tang, H Huang, H Tu, H Liang, M Liang, Z Song, Y Xu, H Jiang, H Yu, Applied Physics Letters 104 (8), 083501, 2014.
“Determination of Polarization-Fields across Polytype Interfaces in InAs Nanopillars”, L Li, Z Gan, MR McCartney, H Liang, H Yu, WJ Yin, Y Fan, Y Gao, J Wang, DJ Smith, Advanced Materials 26 (7), 1052-1057, 2014.
“Two-Dimensional (2D) in-Plane Strain Mapping Using a Laser Scanning Technique on the Cross-Section of Microelectronic Package”, H Liang, T Houghton, Z Song, T Ma, H Nguyen, G Chen, H Jiang, H Yu, IEEE Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015.
“Methods for in-Plane Strain Measurement of a Substrate”, HB Y, H Jiang, H Liang, T Ma, US Patent 10,139,295, 2018.